Reliability Assessment Solutions is the manufacturer of the HATS²™ Via Structure Reliability and Robustness Test System. If you are interested in purchasing a HATS²™ Test System, please use the Contact Form to express your interest and someone will promptly get back to you.
The HATS²™ Technology Platform for the evaluation of Via Structure Reliability and Robustness was developed in 2020 as an update to the original HATS™ test technology, The updated technology addied the capability to test a variety of industry accepted test coupons, the patented HATS²™ Single Via Coupon*, along with custom test coupons containing up to 7 test nets. The updated HATS²™ platform performs multiple cycle Convection Reflow Simulations up to 265°C in accordance with IPC-TM-650 Method 2.6.27 and other customer specific reflow profiles automatically. This Convection Reflow Simulation Methodology with In-Situ resistance measurements can detect cracks and separations in the via structures that occur during the high heat and material expansion of convection reflow which could reconnect mechanically at lower temperatures and not be detectable.
HATS²™ Technology also boasts an improved measurement sub-system capable of high-current, micro-ohm precision, 4-wire resistance measurements. This allows testing of the patented HATS²™ Single Via Test Coupon*, Substrate based test coupons and Custom test coupons containing up to 7 test nets. This updated measurement subsystem also allows HATS²™ units to test up to 72 of the IPC-2221B Type "D" coupons and 36 Traditional or Single Via HATS²™ coupons for both multiple cycle Convection Oven Reflow Simulation and Thermal Shock/Cycling between -65°C and 265°C. For more information about the patented* HATS²™ Single Via Test Coupon, please visit our dedicated HATS²™ web site HATS-Tester.com.
